I got a random thought just now. Imagine an M200 at the start of a print with all of that empty space under the build platform. Now fill all of that space with a thick liquid like corn starch, all the way up to the top of the perf board. As the platform moves down with each layer, the liquid stays in contact with the extruder at all times and, being very thick, can support the weight of plastic placed on top of it (at least for long enough for it to cool down). This would somewhat replicate the advantage powder printers get by surrounding the print with support material. Maybe.
So… Think it would work?